- Author
-
Siu, M.C. I.
|
Carroll, W. L.
|
Watson, T. W.
- Title
- Thermal Conductivity and Electrical Resistivity of Six Copper-Base Alloys.
- Coporate
- National Bureau of Standards, Washington, DC
- Report
-
NBSIR 76-1003,
March 1976,
21 p.
- Distribution
- Available from National Technical Information Service
- Keywords
-
copper
|
thermal conductivity
|
electrical resistivity
|
copper-base alloy properties
|
Smith-Palmer equation
- Abstract
- Measurements of the thermal conductivity, lambda, and electrical resistivity, rho, of oxygen free copper and six copper-base alloys in the temperature range 298 to 924 K are presented. Except for copper, the lamabda and rho values of copper alloys having the same chemical composition as those given in this paper have not been previously reported. The measured values of lambda [equation] and rho [equation] were found to conform, within 10 percent, to the predictions of the Smith-Pa;mer equation, [equation] where T is the thermodynamic temperature expressed in kelvins.