- Author
-
Sankarapandian, M.
|
Shoba, H. K.
|
Sensenich, C.
|
Shih, P.
|
Riffle, J. S.
|
Loos, A. C.
|
McGrath, J. E.
|
Sorathia, U.
- Title
- Void-Free Phenolic Networks.
- Coporate
- Virginia Polytechnic Institute and State Univ., Blacksburg
Naval Surface Warfare Center, West Behesda, MD
- Book or Conf
- Materials and Process Affordability Keys to the Future. SAMPE Symposium and Exhibition, 43rd International Proceedings. Volume 43. Book 1 and Book 2. Society for the Advancement of Material and Process Engineering (SAMPE). May 31-June 4, 1998,
Anaheim, CA,
Kliger, H. S.; Rasmussen, B.; Pilato, L. A.; Tolle, T. B., Editors,
1550-1559 p.,
1998
- Keywords
-
technology transfer
|
education
|
epoxy resins
|
calorimetry
|
heat release rate
|
thermal properties
|
mechanical properties
- Identifiers
- Novolac-Epoxy networks; chemical structures of the epoxy components explored; volatile free curing of a novolac with a stoichiometric deficiency of an epoxy resin; relationships between network density and thermal and mechanical properties of phenolic/epoxy networks