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Author
Miller, L.
Title
Electrical Characteristics of the Materials Used in the Fabrication of Law Temperature Transfer Tape.
Coporate
Pacific Microelectronics Corp., Portland, OR
Book or Conf
International Society for Optical Engineering (SPIE). Proceedings of the International Conference and Exhibition on Multichip Modules (ICEMM). 1993, Soc. of Photo-Optical Instrumentation Engineers,WA, Denver, CO, 68-72 p., 1993
Keywords
dielectric materials | laminates | low temperature | electrical properties
Identifiers
International Electronics Pacaging Society (ISHM); Institute for Interconnecting and Packaging Electronic Circuits (IPS); ceramic materials; strength of materials; transfer tape materials; ceramic substrate low fire tape; transfer tape fabrication; laminating strategies; lamination; kiln processing; resistors