- Author
- Nguyen, T. | Byrd, W. E. | Bentz, D. P.
- Title
- Quantifying Water at the Organic Film/Hydroxylated Substrate Interface.
- Coporate
- National Institute of Standards and Technology, Gaithersburg, MD
- Book or Conf
- Adhesion Conference Proceedings. February 1993, Williamsburg, VA, 1-3 p., 1993
- Keywords
- water | substrates | FT-IR | organic film
- Abstract
- Water at the organic film/ substrate interface causes disbondment of coated substrates when these materials are exposed to an aqueous solution or high relative humidities. The most visible effects are blistering and delamination. For metal substrates, water is necessary for corrosion reactions to occur. Measurement of water at the organic film/substrate interface is a subject of great interest in many fields such as polymer coatings, adhesives, and asphalt pavements. In a previous publication, we reported the development of a technique based on Fourier transform infrared - multiple internal reflection (FTIR-MIR) spectroscopy for studying in situ water at the polymer/metal interface. This paper presents a quantitative study of water at the interface between an organic film and a hydroxylated substrate. Since the surface of most common metals is covered with an hydroxylated oxide layer, quantitative information on water at the organic film/hydroxylated substrate interface should enhance our understanding of the mechanisms of blistering, delamination, and corrosion of coated materials.