- Author
- Cramer, S. M. | Friday, O. M. | White, R. H. | Sriprutkiat, G.
- Title
- Mechanical Properties of Gypsum Board at Elevated Temperatures.
- Coporate
- University of Wisconsin-Madison, WI Forest Products Lab., Madison, WI
- Distribution
- FOR MORE INFORMATION CONTACT: Interscience Communications Limited, West Yard House, Guildford Grove, Greenwich London, SE10 8JT, England. Telephone: +44 (0)20 8692 5050, Fax: +44 (0)20 8692 5155, Email: intercomm@dial.pipex.com, Website: http://www.intercomm.dial.pipex.com
- Book or Conf
- Fire and Materials 2003. 8th International Conference. Conference Papers. Proceedings. Organised by Interscience Communications Limited. January 27-28, 2003, San Francisco, CA, 33-42 p., 2003
- Keywords
- gypsum board | mechanical properties | temperature | shrinkage | mass loss
- Identifiers
- engineering average properties of 15.9-mm Type X gypsum board for structural modeling