- Author
- Sankarapandian, M. | Shoba, H. K. | Sensenich, C. | Shih, P. | Riffle, J. S. | Loos, A. C. | McGrath, J. E. | Sorathia, U.
- Title
- Void-Free Phenolic Networks.
- Coporate
- Virginia Polytechnic Institute and State Univ., Blacksburg Naval Surface Warfare Center, West Behesda, MD
- Book or Conf
- Materials and Process Affordability Keys to the Future. SAMPE Symposium and Exhibition, 43rd International Proceedings. Volume 43. Book 1 and Book 2. Society for the Advancement of Material and Process Engineering (SAMPE). May 31-June 4, 1998, Anaheim, CA, Kliger, H. S.; Rasmussen, B.; Pilato, L. A.; Tolle, T. B., Editors, 1550-1559 p., 1998
- Keywords
- technology transfer | education | epoxy resins | calorimetry | heat release rate | thermal properties | mechanical properties
- Identifiers
- Novolac-Epoxy networks; chemical structures of the epoxy components explored; volatile free curing of a novolac with a stoichiometric deficiency of an epoxy resin; relationships between network density and thermal and mechanical properties of phenolic/epoxy networks