- Author
- Granath, G.
- Title
- Rengoring av elektronik vid tillverkning och sanering. [Post Solder Cleaning Methods Used in Circuit Board Manufacture.] (Abstract in English)
- Coporate
- Swedish Institute of Production Engineering Research, Sweden
- Report
- IVF-Report GE9001, May 18, 1990, 50 p.
- Keywords
- electronics | manufacturing | cleanup | decontamination | smoke | tests
- Identifiers
- circuit boards; deposition of corrosive smoke; surface mount compounds
- Abstract
- The report gives a description of post solder cleaning methods used in circuit board manufacturing and a description of methods used in the decontamination of electronics which have been contaminated, e.g., due to deposition of corrosive smoke from fires. The detrimental effects of circuit board contamination are discussed as well as measurement methods to detect contamination and cleanliness standards related to circuit board manufacturing. The objects when cleaning a smoke contaminated electronics equipment is to remove such deposits which may cause damages and to restore the funciton of the equipments. However, even small smounts of residues left on the circuit board after the cleaning operation may have an impact on the future reliability of the equipment, e.g., by causing poor contact, descreased surface insulation resistance between component leads and short circuits due to migration. The use of surface mount components in electronics is increasing. Circuit boards with surface mount components are more difficult to clean than boards which have been manufactured using ordinary through-hole techique. The increasing use of surface mount components may cause problems in future decontamination of electronics. Laboratory tests to determine the impact of surface mount components on the efficiency of the methods which are used to clean smoke contaminated circuit boards as well as laboratory tests to determine the influence of smoke residues on surface insulation resistance and migration are recommended.